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The most excellent stress relaxation property of all the copper alloys.
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Comparable to beryllium copper alloy in strength and hardness.
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Applied widely to electronic appliances, communication devices, and electric equipment because of its eco-friendliness for its chemical composition.
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No heat treatment required for hardening.
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| Ti |
Cu + Ti |
| 2.9-3.5 |
 99.5 |
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| (wt.%) |
| Temper |
Tensile Strength
N/mm2 |
Elongation**
% |
Hardness
HV |
Kb Value**
N/mm2 |
Yield Strength (0.2% offset)*
N/mm2 |
Electrical Conductivity*
%IACS |
Modulus of Elasticity*
kN/mm2 |
| 1/4H |
735-930 |
10-30 |
250-300 |
635 |
700 |
14 |
127 |
| 1/2H |
785-980 |
8-25 |
270-320 |
685 |
760 |
13 |
125 |
| H |
835-1030 |
8-25 |
280-330 |
735 |
810 |
12 |
122 |
| EH |
885-1080 |
5-20 |
300-350 |
785 |
900 |
12 |
117 |
| SH |
930-1130 |
3-10 |
310-350 |
885 |
990 |
9 |
108 |
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1) *Reference value only. **Refernce Value only in less than 0.15mm thickness
2) In each temper, covered thickness range for production is limited. |
| Temper |
90 W-MBR/t * |
180W-MBR/t ** |
| GW |
BW |
GW |
BW |
| 1/4H |
1 |
1.5 |
1.5 |
2 |
| 1/2H |
1.5 |
2 |
2 |
2.5 |
| H |
1.5 |
3 |
2 |
3.5 |
| EH |
2 |
6 |
2.5 |
4.5 |
| SH |
3 |
- |
4 |
- |
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* By JIS H3130.
** By JIS Z2248 wipe bending method. |
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Initial stress : Kb 0.7 Heat exposure time : 1000hrs |
Remaining
Stress
Ratio (%) |
 |
|
Exposure Temperature( ) |
 *
 |
Density at 20 |
g/cm3 |
8.68 |
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| Modulus of Elasticity |
kN/mm2 |
117(EH) |
|
| Modulus of Rigidity |
kN/mm2 |
47(EH) |
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| Poisson's Ratio |
- |
0.33 |
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| Electrical Resistivity |
   m |
0.14(EH) |
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| Thermal Conductivity at 20 |
W/(mK) |
50(EH) |
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| Coefficient of Thermal Expansion at 20-200 |
 10-6 |
17.6 |
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| Melting Point Solidus |
|
980 |
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| Melting Point Liquidus |
|
1075 |
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| Magnetic Properties |
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Non Magnetic |
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| Specific Heat |
J/(kgK) |
400 |
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| *Standard value only. |
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The specifications shown above are those as of June, 2006.
The specifications are subject to change without notice. |
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