Micro Connectors, Micro SW, Micro Springs, Low Profile B to B Connectors Excellent combination between over 1kN/mm² yield strength which is highest strength as mill-hardened materials and best bend formability Excellent stress-relaxation and fatigue strength which are major characteristics of Ti-Cu are kept as typical Ti-Cu. Ti is the only additive and meet all environmental requirements Suitable for replacement of High-strength Be-Cus Ti Cu+Ti 2.9-3.5 ≧99.5 (wt.%) (Nominal) Density(20ºC) g/cm³ 8.68 Modulus of Elasticity kN/mm² LD 125 TD 135 Poisson's Ratio - 0.33 Electrical Resistivity µΩ·cm 0.14 Thermal Conductivity (20ºC) W/(m·K) 50 Thermal Expansion Coefficient (20~200ºC) ×10-6ºC 17.6 Melting Point (Solidus) ºC 980 Melting Point (Liquidus) ºC 1075 Magnetic Properties Non-maginetic Specific Heat J/(kg·K) 400 Temper 0.2%Yield Strength N/mm² Tensile Strength* N/mm² Elongation* % Hardness Vickers* HV Electrical Conductivity* %IACS Remarks Thickness Range** H 850-1000 920-1080 10min 300-340 13 ≦0.25mm ≧830 0.25-0.30 EH 900-1050 970-1100 6min 310-360 13 ≦0.22mm ≧880 0.22-0.30 SH 950-1150 1010-1200 3min 315-380 13 ≦0.20mm ESH 1000-1200 1050-1250 - 320-400 13 ≦0.15mm 1) * For reference only 2) ** Latest available thickness range should be confirmed Temper 90º W-Bend* Remarks G.W.(R/t) B.W.(R/t) Thickness Range** H 0.0 0.5 ≦0.15mm 0.5 1.0 0.15-0.25 1.0 1.5 0.25-0.30 EH 0.0 1.0 ≦0.12mm 1.0 2.0 0.12-0.22 1.0 2.5 0.22-0.30 SH 0.0 1.0 ≦0.08mm 1.0 2.0 0.08-0.10 1.0 3.0 0.10-0.20 ESH 0.5 4.0 ≦0.08mm 1.0 6.0 0.08-0.15 1) *JIS H3130 2) ** Latest available thickness range should be confirmed The specifications shown above are those as of August, 2009. The specifications are subject to change without notice.