|
 |
 |
Good combination of better bend formability and higher yield strength than standard YCuT-M.
|
|
Same chemical composition as YCuT-M with eco-friendliness.
|
|
Same properties of resistance against fatigue, heat, and corrosion as standard YCuT-M.
|
|
No heat treatment required for hardening.
|
| Ti |
Cu + Ti |
| 2.9-3.5 |
 99.5 |
|
| (wt.%) |
| Temper |
Tensile Strength
N/mm2 |
Elongation**
% |
Hardness
HV |
Kb Value**
N/mm2 |
Yield Strength (0.2% offset)*
N/mm2 |
Electrical Conductivity*
%IACS |
Modulus of Elasticity*
kN/mm2 |
| H |
885-1080 |
3-20 |
290-340 |
785 |
910 |
12 |
125 |
| EH |
980-1180 |
1-5 |
310-360 |
885 |
1020 |
12 |
122 |
| SH |
1030-1290 |
- |
320-380 |
930 |
1160 |
9 |
120 |
|
1) *Reference value only. **Refernce Value only in less than 0.15mm thickness
2) In each temper, covered thickness range for production is limited. |
| Temper |
90 W-MBR/t * |
180W-MBR/t** |
| GW |
BW |
GW |
BW |
| H |
0.5 |
3 |
1.5 |
3 |
| EH |
1 |
5 |
2 |
6 |
| SH |
3 |
- |
3 |
- |
|
* By JIS H3130.
** By JIS Z2248 wipe bending method. |
 *
 |
Density at 20 |
g/cm3 |
8.68 |
|
| Modulus of Elasticity |
kN/mm2 |
125(H) |
|
| Modulus of Rigidity |
kN/mm2 |
48(H) |
|
| Poisson's Ratio |
- |
0.33 |
|
| Electrical Resistivity |
   m |
0.14(H) |
|
| Thermal Conductivity at 20 |
W/(mK) |
50(H) |
|
| Coefficient of Thermal Expansion at 20-200 |
 10-6 |
17.6 |
|
| Melting Point Solidus |
|
980 |
|
| Melting Point Liquidus |
|
1075 |
|
| Magnetic Properties |
|
Non Magnetic |
|
| Specific Heat |
J/(kgK) |
400 |
|
|
| *Standard value only. |
|
The specifications shown above are those as of June, 2006.
The specifications are subject to change without notice. |
|
