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 |
 |
Very good in bend formability and high electrical conductivity for connectors. This unique combination of properties lends the alloy to uses in a vast array of applications including CPU sockets, automotive and electrical connectors and various springs.
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Particularly suitable for replacement of beryllium copper alloy, with eco-friendliness and cost competitiveness for its chemical composition.
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Excellent bend formability though its strength is higher than C7025.
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Very good stress relaxation and heat resistance properties at elevated temperature as well as C7025.
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No heat treatment required for hardening.
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| Ni |
Co |
Si |
Cu |
| 1.5 |
1.1 |
0.6 |
Bal. |
|
| (wt.%) |
 *
 |
Density at 20 |
g/cm3 |
8.82 |
|
| Modulus of Elasticity |
kN/mm2 |
131 |
|
| Elecrical Resistivity |
   m |
3.4-3.8 10-2 |
|
| Thermal Conductivity at 20 |
W/(mK) |
2.0102 |
|
| Coefficient of Thermal Expansion at 20-300 |
10-6 |
17.6 |
|
| Melting Point Liquidus |
|
1095 |
|
| Melting Point Solidus |
|
1075 |
|
| * Reference value only. |
| Temper |
Yield Strength (0.2% offset)
N/mm2 |
Tensile Strength*
N/mm2 |
Elongation*
% |
Hardness*
HV |
Electrical Conductivity*
%IACS |
| TM04 |
750-850 |
770-900 |
4min |
 220 |
50 |
| TM06 |
810-920 |
840-970 |
1min |
240 |
45 |
|
|
1)* Reference value only.
2) In each temper, covered thickness range for production is limited. |
 *
| Temper |
90 MBR/t
GW/BW |
| TM04 |
| 1.5/1.5 |
( Below 0.150mm t ) |
| 2.0/2.0 |
( More than 0.150mm t ) |
|
| TM06 |
| 2.0/2.0 |
( Below 0.150mm t ) |
| 2.5/2.5 |
( More than 0.150mm t ) |
|
|
|
| * Reference value only. |
|
The specifications shown above are those as of June, 2007.
The specifications are subject to change without notice. |
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