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Mg-modified Corson alloy (Cu-Ni-Si)
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High performance alloy (HPA) for leadframes.
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Particularly suitable for high-pin count leadframes and for low profile IC package leadframes.
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| Ni |
Si |
Mg |
Cu |
| 3.0 |
0.65 |
0.15 |
Bal. |
|
| (wt.%) |
 *
 |
Density at 20 |
g/cm3 |
8.82 |
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| Modulus of Elasticity |
kN/mm2 |
132 |
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| Elecrical Resistivity |
   m |
4.3 1-2 |
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| Thermal Conductivity at 20 |
W/(mK) |
1.72102 |
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| Coefficient of Thermal Expansion at 20-300 |
10-6 |
17.3 |
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| Melting Point Liquidus |
|
1095 |
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| Melting Point Solidus |
|
1075 |
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| * Reference value only. |
| Temper |
Tensile Strength
N/mm2 |
Elongation*
% |
Hardness*
HV |
Electrical Conductivity
%IACS |
| 1/4H |
460-607 |
8min |
140-180 |
40min |
| 1/2H(TR02) |
607-726 |
6min |
180-220 |
40min
(Nominal 50) |
| 3/4H |
658-784 |
4min |
190-240 |
38min |
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| * Reference value only. |
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The specifications shown above are those as of June, 2006.
The specifications are subject to change without notice. |
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