|
 |
 |
Mg-modified Corson alloy (Cu-Ni-Si)
|
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Good in bend formability and high electrical conductivity for connectors.
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Particularly suitable for replacement of beryllium copper alloy, with eco-friendliness and cost competitiveness for its chemical composition.
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Very good stress relaxation and heat resistance properties at elevated temperature.
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No heat treatment required for hardening.
|
| Ni |
Si |
Mg |
Cu |
| 3.0 |
0.65 |
0.15 |
Bal. |
|
| (wt.%) |
 *
 |
Density at 20 |
g/cm3 |
8.82 |
|
| Modulus of Elasticity |
kN/mm2 |
132 |
|
| Elecrical Resistivity |
   m |
4.3 10-2 |
|
| Thermal Conductivity at 20 |
W/(mK) |
1.72102 |
|
| Coefficient of Thermal Expansion at 20-300 |
10-6 |
17.3 |
|
| Melting Point Liquidus |
|
1095 |
|
| Melting Point Solidus |
|
1075 |
|
| * Reference value only. |
| Temper |
Yield Strength (0.2% offset)
N/mm2 |
Tensile Strength*
N/mm2 |
Elongation*
% |
Hardness*
HV |
Electrical Conductivity*
%IACS |
| TM00 |
450-620 |
620-760 |
10min |
 180 |
40min |
| TM02 |
590-760 |
655-830 |
7min |
190 |
40min |
| TM03 |
655-830 |
690-860 |
5min |
200 |
35min |
| TM03 HDC** |
690-830 |
710-860 |
3min |
- |
45min |
|
|
1)* Reference value only.
2) In each temper, covered thickness range for production is limited.
3)**HDC (High Density Connector) : Developed specifically for socket contacts
demanding very narrow tight bend performance. |
 *
| Temper |
90 MBR/t
GW/BW |
| TM00 |
1.5/1.25 |
| TM02 |
2.5/1.5 |
| TM03 |
2.5/2.0 |
| TM03 HDC |
- |
|
|
| * Reference value only. |
|
The specifications shown above are those as of June, 2006.
The specifications are subject to change without notice. |
|
